Summary of requirements for Masters degree programs in the School of Materials

 

There are four Masters degree programs offered in the Arizona State University School of Materials.

• Master of Science Degree (MS) in Materials Science and Engineering
• Master of Science in Engineering Degree (MSE) in Materials Science and Engineering – General.
• Master of Science in Engineering Degree (MSE) with a
  Specialization in Semiconductor Processing and Packaging - Packaging Track
• Master of Science in Engineering Degree (MSE) with
  Specialization in Semiconductor Processing and Packaging - Processing Track

 

Summary table of credit requirements for Masters degree programs in the School of Materials

	Total	Core	Electives	Seminar	Thesis	R/C	Project
MS (thesis)	32	6	18-15	2	6	0-3	0
MSE-gen	32	0	30-24	2	0	0-6	0
MSE-SPM	32	18	12-6	2	0	0	0-6
MSE-MEP	32	18	12-6	2	0	0	0-6

 

Master of Science Degree (MS) in Materials Science and Engineering.

A total of 32 credits are required for the Master of Science Degree (MS) in Materials Science and Engineering, as detailed below. This degree includes a thesis.

Core (6cr)
Students must take 6 credits of core courses selected from the table below. Note that the choice 4bc requires both PHY511 and 512 but only the latter may be counted as a technical elective. This selection is most appropriate for students who have some background in modern physics.

 

Technical Electives (18cr)
Students must take 18 credits of technical electives, with the following conditions:

• Either IEE570 (Advanced Quality Control) or IEE572 (Design of Experiments) are highly recommended.
• Up to 6 credits may be at the 400+ level.
• Up to 9 credits may be outside MSE, by approval.
• Up to 3 credits of reading and conference may be taken in place of 3 credits electives.

Seminar (2cr)
Students must take 2 credits of seminar (MSE 591), which is 1 credit/semester.

Thesis (6cr)
Students must take 6 credits thesis (MSE 599), complete a thesis and pass the thesis defense examination.

Preparatory Courses:
Students with deficiencies in any of the following areas are required to complete remedial courses in those areas, in addition to the graduate coursework listed above

A.  Mathematics and Basic Sciences

• Mathematics:  Calculus through "Partial Differential Equations” (e.g. MAT 270, 271, 272, and 274 typically a total of 15 semester hours of credit total).
• Physics:   One year of calculus-based physics, including laboratory (8 semester hours) and one course in modern physics (3 semester hours).
• Chemistry:   Two semesters of General Chemistry, including laboratory (8 semester hours), and one semester of Physical Chemistry (3 semester hours).
• Computers:   Demonstration of computer literacy through coursework or a diagnostic exam.

B.  Engineering Core Courses

• Structure/Properties Materials (MSE250, or former ECE 350)
• Probability and Statistics (ECE 380)
• One or more of the following:  Static (ECE 210); Electrical Networks (ECE 301); Introduction to Deformable Solids (ECE 313); Thermodynamics (ECE 340)
• Intermediate Engineering Design (ECE 300) or Materials Engineering Design (MSE 482) unless engineering design experience.
• Other Prerequisite Courses: Any other course that is a prerequisite for a course in the student's graduate program of study.

 

C.  Materials Science and Engineering Fundamentals.

Depending upon the student's stated intentions to pursue a graduate program with a particular emphasis, the student's supervisory committee may require that the student's undergraduate degree program include any of the following courses, or the equivalent thereof, which provide basic undergraduate fundamentals in materials science engineering.  In the event that the student’s undergraduate program does not contain those courses identified as required, then those courses may be considered as deficiencies, and the student will be expected to take those courses in addition to the 32 hours of coursework required for the degree.  

• Structure and Properties of Materials (equivalent to MSE250, or former ECE 350)
• Introduction to Metallurgy (equivalent to MSE 355)
• Thermodynamics of Materials (equivalent to MSE 430)
• Mechanical Properties of Solids (equivalent to MSE 440)
• X-ray Diffraction (equivalent to MSE 450)
• Polymers and Composites (equivalent to MSE 470)
• Ceramics (equivalent to MSE 471)

Master of Science in Engineering Degree (MSE) in Materials Science and Engineering – General.

A total of 32 credits are required for the Master of Science in Engineering Degree (MSE) in Materials Science and Engineering, as detailed below. Students in this program usually pursue the degree while working full-time off campus.  Financial assistance is not available to students in this program. This degree has no thesis. Three options are available: General or Concentration in Semiconductor Processing and Packaging (SPP) with the Processing or the Packaging track. Courses for the SPP Concentrations are available entirely online.

The requirements for this program (General track) follow those for the Master of Science Degree (see above), except: replace 6 credits of thesis with 6 credits of technical electives or reading/conference (advisor approval) or applied project (advisor approval). Students must also complete a report (15-20 pages with figures and references) on a topic of their choice, which must be approved by the advisory committee.  At the conclusion of the report, the student will make an oral presentation on the topic to his/her committee.

Master of Science in Engineering Degree (MSE) with a
Specialization in Semiconductor Processing and Packaging - Packaging Track

The Master of Science in Engineering Degree (MSE) with specialization in Semiconductor Processing and Packaging - Packaging Track follows the admission requirements of the MSE - General degree  (with course requirements listed below), and features on-line courses in the specialty area. A current list of online offerings for SPP-Packaging can be found at SPP Packaging Courses. This degree has no thesis.

Core: (18 credits)
Select 18 credits (3+9+3+3) from the 4 groups below. All courses in the core are offered both on-campus and on-line.

MSE 518	(3)	Intro. to Microelectronics Packaging	Fall
3 Packaging Courses	(9)	Choose three courses from:
EEE 691		Electrical Considerations (3)	Fall
IEE 691		Advanced Analysis Methods (3)	Fall
MAE 602		Mechanical Considerations (3)	Fall
MAE691		Thermal Considerations (3)	Spring
MSE 691		Material Considerations (3)	Spring
1 Math Course	(3)	Strongly recommended:
IEE 591		DOE/SPC for Semiconductor Processing
or IEE 570		Advanced Quality Control	Spring
or IEE 572		Design of Engineering Experiments	Fall & Spring
1 Bus. Course	(3)
IEE 552		Strategic Tech Planning (or equivalent)

 

Technical Electives (12 cr) – see suggested list below
Students must take 12 credits of technical electives, with the following conditions:

1. MSE519: Growth and Processing of Semiconductors is highly recommended.
2. At least two courses are from a single engineering discipline
3. At least one course are from a second engineering discipline
4. Up to 6 credits may be at the 400+ level.
5. Up to (6) credits of applied project or reading/conference may be taken in place of 6 cr technical electives. This can be done at an industrial site (or at local universities) in collaboration with ASU faculty and local industry mentors.
6. Coursework can be done at UofA or NAU through the M. Eng. Partnership (with advisor approval).
7. Leveling courses (see below) are recommended for students who lack the appropriate background (see advisor), and may be taken as technical electives.

Seminar (2cr)
2 credits seminar (MSE 591), which is 1 credit/semester. All presentations are available on-line.

Culminating Event
Students must complete a report (at least 15 double spaced pages with figures and references) or make an oral presentation of an applied project on a microelectronics packaging related topic of their choice (the topic needs to be approved by their advisor).  For the distance learning students, a web-based virtual meeting and/or an oral telephone question session can be substituted for the oral presentation. 

 

Master of Science in Engineering Degree (MSE) with
Specialization in Semiconductor Processing and Packaging - Processing Track

The Master of Science in Engineering Degree (MSE) with specialization in Semiconductor Processing and Packaging - Processing Track follows the requirements of the MSE - General degree (with course requirements listed below), and features on-line courses in the specialty area. A current list of online offerings for SPP-Processing can be found at SPP Processing Courses. This degree has no thesis.

Core (15cr)
Choose 15 credits from the 5 groups shown below. Options 1, 3, 4 and 5 are recommended. All courses in the core are offered both on-campus and on-line.

EEE 435	(3)	Microelectronics	Spring
or EEE 531		Semiconductor Device Theory I	Fall
or CHE 458/598		Semiconductor Materials Processing
or EEE 530		Advanced Silicon processing
IEE 591	(3)	DOE/SPC for Semiconductor Processing
or IEE 570		Advanced Quality Control	Spring
or IEE 572		Design of Engineering Experiments	Fall & Spring
MSE 510	(3)	Introduction to Materials Characterization	Spring
or EEE536		Semiconductor Characterization	Spring
MSE 598	(3)	Electronic Thin Films	Fall
or MSE 519		Growth and processing of semiconductors	Spring
MSE 598	(3)	Elec., magnetic and optical props. of solids	Spring

 

Technical Electives (12 cr) – see suggested list below
Students must take 12 credits of technical electives. MSE518: Fundamentals of Microelectronics Packaging I highly recommended. Up to (6) credits of applied project or reading/conference may be taken in place of 6 credits of technical electives. Reading and Conference is independent study in which a student meets regularly with a faculty member to discuss assignments.  The course may include such assignments as intensive reading in a specialized area, writing a synthesis of literature on a specified topic, or writing a literature review of a topic. Applied Project can be done at an industrial site (or at local universities) in collaboration with ASU faculty and local industry mentors.

Seminar (2cr)
2 credits seminar (MSE 591), which is 1 credit/semester. All presentations are available on-line.

Culminating Event
A culminating event that captures the essence of the master’s degree focus and represents a major portion of the student’s course work is required for this degree.  The event consists of an overview report and presentation incorporating knowledge gained from the program with integration and reflection of learning as applied to the job.  This comprehensive report, typically 20 pages (double-spaced) plus figures, is on a topic of the student’s choice but is approved by the faculty supervisory committee. Arrangements can be made for the distance learning students to conduct an oral telephone examination.

Suggested Technical Electives for SPP tracks

Leveling Courses (recommended for students who lack this background)

• EEE 598  -  Electrical Engineering
• IEE 598   -  Industrial Engineering
• MAE 598 - Mechanical Engineering
• MAE 589 - Heat Transfer
• MSE 598  - Materials Engineering
•  

Electrical Engineering

• EEE440: Electromagnetic Engineering II
• EEE436: Fundamentals of Solid State Devices
• EEE530: Advanced Silicon Processing
• EEE531: Semiconductor Device Theory I
• EEE532: Semiconductor Device Theory II
• EEE541: Electromagnetic Fields and Guided Wave
• EEE598: Microelectromechanical Systems (MEMS)
• EEE641: Advanced Electromagnetic Field Theory
• EEE643: Advanced Topics in Electromagnetic Radiation
• Mechanical Engineering
• MAE520: Solid Mechanics
• MAE527: Finite Element Methods in Engineering Science
• MAE544: Mechanical Design and Failure Prevention
• MAE557: Mechanics of Composite Materials
• Industrial Engineering
• IEE500: Research Methods: Engineering Statistics
• IEE569: Advanced Statistics Methods
• IEE572: Design of Engineering Experiments
• IEE573: Reliability Engineering
• IEE582: Response Surfaces and Process Optimization
• Materials Engineering
• MSE512: Analysis of Material Failures
• MSE513: Polymers and Composites
• MSE517: Introduction to Ceramics
• MSE540: Fracture, Fatigue, and Creep
• MSE516: Mechanical Properties of Solids
• MSE518: Fundamentals of Microelectronics Packaging*
• MSE519: Growth and Processing of Semiconductors+
• MSE550: Advanced Materials Characterization
• MSE570: Polymer Structure and Properties
• MSE571: Ceramics
• MSE598: Electronic Thin Films+
• * This course is strongly recommended for all students pursuing Semiconductor Processing track.
• + Either of these two courses is highly recommended for students pursuing Packaging track
• Chemical Engineering
• CHE 458: Semiconductor Material Processing
• CHE 558: Electronic Materials
• Other
• CSE598: Modeling and Simulation